Fan-out wafer-level packaging

Fan-out Wafer Level Packaging (FO-WLP) is a way of making tiny chips that can fit into electronics such as phones and computers. It's like when you make a cake, and you can fit lots of pieces together. In FO-WLP, small pieces of silicon (like the cake pieces) are held together by tiny wires that are placed all around them. These wires allow the pieces to fit together and have electrical signals sent from one piece to another. It also helps protect the pieces from being damaged by water and other outside forces. FO-WLP makes it possible for electronics to be smaller, faster, and more powerful.