Wafer backgrinding

Okay kiddo, have you ever eaten a sandwich? Well, imagine the bread is like a super tiny computer chip inside a big sandwich. The bread represents the wafer in the chip-making process.

But before we can put the yummy fillings in the sandwich, we need to make the bread thinner so we can put more filling in. This is where wafer backgrinding comes in!

Wafer backgrinding is like when we use a big cheese grater to grate the bread to make it really thin. The wafer is put onto a big spinning machine that has a special wheel on it. This wheel has small grains of sand on it and grinds away a little bit at a time until the wafer is really thin.

Once the wafer is thin enough, we can start to add the fillings. In the chip-making process, this means adding different layers to the wafer to build up the different parts of a computer chip.

So, in summary, wafer backgrinding is like grating bread to make it really thin so that we can add more yummy fillings, except with a computer chip wafer instead of bread and a special sand-grinding wheel instead of a cheese grater. Hope that helps!