Wafer bond characterization
Okay, imagine you're playing with Legos. You have two Lego pieces that you want to stick together. You could use glue or tape, but that's not very strong or reliable. So instead, you decide to use a special tool called a wafer bonder. It's like a magic wand that makes the two Lego pieces stick together really, really well.
But after you've used the wafer bonder, you want to make sure that the Lego pieces are really stuck together. You need to check and see if the bond is strong enough. That's called wafer bond characterization.
To do this, you look at the bond under a microscope. You can see how the two Lego pieces fit together, and how tight the bond is. You can also use special instruments to measure how strong the bond is. This tells you if the bond will hold up over time, or if it might come apart later.
So, wafer bond characterization is like checking to make sure that the Legos are really stuck together properly, to make sure they don't fall apart later.
But after you've used the wafer bonder, you want to make sure that the Lego pieces are really stuck together. You need to check and see if the bond is strong enough. That's called wafer bond characterization.
To do this, you look at the bond under a microscope. You can see how the two Lego pieces fit together, and how tight the bond is. You can also use special instruments to measure how strong the bond is. This tells you if the bond will hold up over time, or if it might come apart later.
So, wafer bond characterization is like checking to make sure that the Legos are really stuck together properly, to make sure they don't fall apart later.